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Basics of ICs – 12

12. In IC fabrication, gettering is a process by which :

(a) The silicon wafer is highly polished
(b) The silicon wafer is pre-heated to an optimum temperature for diffusion
(c) The harmful impurities or defects are removed from the region in a wafer where devices are to be fabricated
(d) Wafers are sliced into thin films

Answer : (c)

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