Basics of ICs – 9

9. The function of SiO2 layer in IC fabrication is :

(a) Oxide masking
(b) Oxide passivation
(c) Oxide purification
(d) Both a & b

Answer

Answer : (d)

Explanation

Explanation : No answer description available for this question. Let us discuss.

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Basics of ICs - 8
Basics of ICs » Exercise - 18. The active components of the IC’s are formed in : (a) The substrate (b) SiO2layer (c) Epitaxial layer (d) None of these
Tags: basics, ics, layer, exercise, ic, sio, electronics, engineering
Basics of ICs - 2
Basics of ICs » Exercise - 12. The active components of the IC’s are formed in : (a) the substrate (b) SiO2 layer (c) epitaxial layer (d) none of these
Tags: basics, ics, layer, exercise, ic, sio, electronics, engineering
Basics of ICs - 17
Basics of ICs » Exercise - 117. Ultraviolet radiation is used in IC fabrication for : (a) Diffusion (b) Masking (c) Isolation (d) Metallization
Tags: basics, ics, exercise, ic, fabrication, masking, electronics, engineering
Basics of ICs - 28
Basics of ICs » Exercise - 128. The SiO2 layer in an IC acts as ................. (a) a resistor (b) an insulating layer (c) mechanical output (d) none of the above
Tags: basics, ics, layer, exercise, sio, ic, electronics, engineering
Basics of ICs - 21
Basics of ICs » Exercise - 121. ICs are generally made of ................. (a) silicon (b) germanium (c) copper (d) none of the above
Tags: ics, basics, exercise, electronics, engineering

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