12. In IC fabrication, gettering is a process by which :
(a) The silicon wafer is highly polished
(b) The silicon wafer is pre-heated to an optimum temperature for diffusion
(c) The harmful impurities or defects are removed from the region in a wafer where devices are to be fabricated
(d) Wafers are sliced into thin filmsSubject Name : Electronics Engineering Exam Name : IIT GATE, UPSC ESE, RRB, SSC, DMRC, NMRC, BSNL, DRDO, ISRO, BARC, NIELIT Posts Name : Assistant Engineer, Management Trainee, Junior Engineer, Technical Assistant Electronics & Communication Engineering Books
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