Basics of ICs – 7

7. In IC fabrication, metallization means :

(a) Depositing SiO2 layer
(b) Covering with metallic cap
(c) Forming interconnection conduction pattern
(d) All of the above

Answer

Answer : (b)

Explanation

Explanation : No answer description available for this question. Let us discuss.

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Basics of ICs - 3
Basics of ICs » Exercise - 13. In IC fabrication, metallization means : (a) depositing SiO2 layer (b) covering with metallic cap (c) forming interconnection conduction pattern (d) all of the above
Tags: basics, ics, pattern, conduction, interconnection, forming, cap, metallic, layer, covering
Basics of ICs - 28
Basics of ICs » Exercise - 128. The SiO2 layer in an IC acts as ................. (a) a resistor (b) an insulating layer (c) mechanical output (d) none of the above
Tags: basics, ics, layer, exercise, sio, ic, electronics, engineering
Basics of ICs - 2
Basics of ICs » Exercise - 12. The active components of the IC’s are formed in : (a) the substrate (b) SiO2 layer (c) epitaxial layer (d) none of these
Tags: basics, ics, layer, exercise, ic, sio, electronics, engineering
Basics of ICs - 17
Basics of ICs » Exercise - 117. Ultraviolet radiation is used in IC fabrication for : (a) Diffusion (b) Masking (c) Isolation (d) Metallization
Tags: basics, ics, exercise, ic, fabrication, metallization, electronics, engineering
Basics of ICs - 8
Basics of ICs » Exercise - 18. The active components of the IC’s are formed in : (a) The substrate (b) SiO2layer (c) Epitaxial layer (d) None of these
Tags: basics, ics, layer, exercise, ic, sio, electronics, engineering

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