Basics of ICs » Exercise - 110. Which is the final step in wafer processing sequence ? (a) Photolithography (b) Chemical vapour (c) Metallization (d) Oxidation
Basics of ICs » Exercise - 114. The most common diffusant used in interstitial diffusion in IC fabrication is : (a) Boron (b) Arsenic (c) Nickel (d) Gold
Basics of ICs » Exercise - 13. In IC fabrication, metallization means : (a) depositing SiO2 layer (b) covering with metallic cap (c) forming interconnection conduction pattern (d) all of the above