Basics of ICs – 10

10. Which is the final step in wafer processing sequence ?

(a) Photolithography
(b) Chemical vapour
(c) Metallization
(d) Oxidation

Answer

Answer : (c)

Explanation

Explanation : No answer description available for this question. Let us discuss.

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Basics of ICs - 21
Basics of ICs » Exercise - 121. ICs are generally made of ................. (a) silicon (b) germanium (c) copper (d) none of the above
Tags: ics, basics, exercise, electronics, engineering
Power Amplifiers – 1 - 2
Power Amplifiers » Exercise - 1 (a) (b) (c) (d) (a) (b) (c) (d) (a) (b) (c) (d) (a) (b) (c) (d) (a) (b) (c) (d)
Tags: exercise, electronics, engineering
Basics of ICs - 23
Basics of ICs » Exercise - 123. The most popular form of IC package is ................. (a) DIL (b) flatpack (c) TO-5 (d) none of the above
Tags: basics, ics, exercise, electronics, engineering
Basics of ICs - 22
Basics of ICs » Exercise - 122. .............. ICs are the most commonly used. (a) thin film (b) monolithic (c) hybrid (d) none of the above
Tags: ics, basics, exercise, electronics, engineering
Basics of ICs - 20
Basics of ICs » Exercise - 120. An IC has ................. size. (a) very large (b) large (c) extremely small (d) none of the above
Tags: basics, ics, exercise, electronics, engineering

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