Basics of ICs » Exercise - 12. The active components of the IC’s are formed in : (a) the substrate (b) SiO2 layer (c) epitaxial layer (d) none of these
Basics of ICs » Exercise - 13. In IC fabrication, metallization means : (a) depositing SiO2 layer (b) covering with metallic cap (c) forming interconnection conduction pattern (d) all of the above
Basics of ICs » Exercise - 17. In IC fabrication, metallization means : (a) Depositing SiO2 layer (b) Covering with metallic cap (c) Forming interconnection conduction pattern (d) All of the above