11. Identify the ordered processing steps in fabrication of integrated circuits.
(a) Diffusion, Oxidation, Chemical vapour deposition, Photolithography, Metallization
(b) Oxidation, Diffusion, Chemical vapour deposition, Photolithography, Metallization
(c) Chemical vapor deposition, Oxidation, Diffusion, Photolithography, Metallization
(d) Diffusion, Oxidation, Photolithography, Chemical vapor deposition, Metallization
12. In IC fabrication, gettering is a process by which :
(a) The silicon wafer is highly polished
(b) The silicon wafer is pre-heated to an optimum temperature for diffusion
(c) The harmful impurities or defects are removed from the region in a wafer where devices are to be fabricated
(d) Wafers are sliced into thin films
13. The law, which governs the diffusion process during the IC fabrication, is :
(a) Flicker’s law
(b) Flick law
(c) Fick law
(d) Fickler’s law
14. The most common diffusant used in interstitial diffusion in IC fabrication is :
(a) Boron
(b) Arsenic
(c) Nickel
(d) Gold
15. Metallic crystal possesses :
(a) High optical reflection and absorption coefficient
(b) Good conducting property due to the presence of free electrons
(c) Opaque to all electromagnetic radiations from low frequency to the middle ultraviolet
(d) All of these
Related Posts
Basics of ICs » Exercise - 116. The substrate for IC fabrication is : (a) P type with typical thickness 200 μm (b) P type with typical thickness 50 μm (c) N type with typical thickness 200 μm (d) N type with typical thickness 50 μm- Basics of ICs » Exercise - 1 1. The substrate for IC fabrication is : (a) p type with typical thickness 200 μm (b) p type with typical thickness 50 μm (c) n type with typical thickness 200 μm (d) n type with typical thickness 50 μm
- Basics of ICs » Exercise - 12. The active components of the IC’s are formed in : (a) the substrate (b) SiO2 layer (c) epitaxial layer (d) none of these
- Basics of ICs » Exercise - 13. In IC fabrication, metallization means : (a) depositing SiO2 layer (b) covering with metallic cap (c) forming interconnection conduction pattern (d) all of the above
- Basics of ICs » Exercise - 17. In IC fabrication, metallization means : (a) Depositing SiO2 layer (b) Covering with metallic cap (c) Forming interconnection conduction pattern (d) All of the above